PCB Fabrication

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PCB Fabrication
PCB Fabrication

Crafting the Core of Your Electronics

At Ardra Circuits, we excel in high-quality PCB fabrication, meticulously transforming your designs into robust and reliable circuit boards. Leveraging our state-of-the-art facilities and experienced team, we ensure that every PCB adheres to the highest standards of performance and durability. The process begins with precise schematic design and layout optimization, advancing through careful construction of the bare board. After components are soldered, we perform extensive testing to verify functionality before integrating the board into your final system. Each step is executed with precision to meet your exact specifications and ensure exceptional performance.

PCB Fabrication Process

Key Requirements for PCB Fabrication

1. Circuit Board Specifications:

Before initiating the PCB layout, the design team collaborates closely with the contract manufacturer to define the board's parameters and configuration. Critical details include:

  • Board layer stackup and configuration
  • Controlled impedance layers
  • Minimum trace width and spacing
  • Via types and structures
  • Copper balancing
  • PCB panelization considerations
2. Finalizing the PCB Design:

Ensuring the design is complete is crucial for accurate PCB manufacturing. Key steps include:

  • Comprehensive engineering review of the circuitry
  • Synchronization of schematic and layout databases
  • Placement of all components with no unrouted connections
  • Optimization through circuit simulation and signal integrity analysis
  • PCB Design Rule Check (DRC) with no errors
  • Bill of materials (BOM) review for component availability
  • Design for manufacturing (DFM) rules applied for error-free assembly
3. Preparing Manufacturing Design Data:

Once the design is ready, the following data files are generated and submitted to the contract manufacturer:

  • Gerber or other formatted board layer image files
  • Manufacturing drawings for fabrication and assembly
  • Bill of materials (BOM)
  • Component XY locations for pick & place
  • Test point locations
  • Netlist
  • Schematic
PCB fabrication Essentials

Core Components of PCB Fabrication

PCB fabrication is the process of constructing the bare boards that are the foundation of all electronic devices. This process involves several key elements to ensure the final product meets high standards of quality and performance:

  1. Substrate (FR4):

    Provides structural support and insulation.

  2. Copper Layers:

    Create electrical pathways for circuit connectivity.

  3. Soldermask:

    Protects copper traces and prevents solder bridges.

  4. Silkscreen:

    Adds component labels and reference designators for easy assembly and troubleshooting.

Detailed PCB Fabrication Steps

Step-by-Step Manufacturing Breakdown

Creating Circuitry Images

The initial step involves transferring the PCB design circuitry image data to the board using either photo tooling or direct imaging. Photo tooling uses precision photoplotters to create images on film, while direct imaging employs lasers for higher precision and alignment.

Layer Composition

A multilayer PCB consists of alternating layers of dielectric material and metal conductors. The most common core material, FR-4, is used in combination with copper foil layers to create a composite structure. Each layer is meticulously controlled for width, copper weight, and alignment.

Inner Layer Circuitry Creation

  • Apply a sheet of photoresist material over the copper foil of the core.
  • Expose the photoresist to ultraviolet light or laser to harden it over the circuitry patterns.
  • Etch away the exposed copper, leaving behind the circuitry protected by the hardened photoresist.
  • Strip the photoresist to reveal the copper circuitry.
  • Inspect the core layers using automated optical inspection (AOI) systems for defects.

Lamination

Layer pairs are stacked with sheets of prepreg material between them. The lamination process uses heat and pressure to bond the layers together, forming a solid PCB structure.

Drilling

Drilling is performed to create holes for component mounting, thru-hole vias, and mechanical features. The holes are cleaned and coated with a thin layer of copper to prepare for electroplating.

Top and Bottom Layer Circuitry

  • Cover the board surfaces with photoresist material.
  • Expose the photoresist, plating the exposed areas with additional copper.
  • Apply a layer of tin over the plated copper to protect it.
  • Strip the remaining photoresist and etch the board to create the final circuitry patterns.

Solder Mask, Silkscreen, and Surface Finishes

A solder mask is applied to protect the board during assembly, leaving only the metal pads exposed. Component reference designators and other markings are added through silkscreen printing. Finally, a surface finish, such as hot air solder leveling (HASL), is applied to protect the exposed metal surfaces and assist in soldering.

Final Preparation, Inspection, and Testing

The board undergoes continuity testing and inspection to ensure there are no shorts or defects. Once the board passes all tests, it is prepared for assembly and shipped to the contract manufacturer.

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