Transforming Your Bare Boards into Functional Electronics
At Ardra Circuits, we excel in converting your PCB designs into fully functional electronic devices. Utilizing advanced technology and precise processes, our facilities are equipped to manage each step of the assembly process with meticulous care. From sourcing premium components to detailed testing, our approach ensures accuracy and durability throughout.
Our experienced team is dedicated to delivering high-quality results that meet rigorous performance standards. Whether you need prototypes or large-scale production, we guarantee that your assemblies will perform optimally. Trust Ardra Circuits to provide exceptional, tailored solutions for your specific needs.
Streamlined Solutions for Reliable Performance
1. Component Sourcing and Preparation
We start by sourcing high-quality components and preparing them for assembly. Our team ensures that all parts are verified for accuracy and availability, mitigating any potential issues before assembly begins.
| Activity | Description | Benefits |
|---|---|---|
| Component Sourcing | Procuring high-quality components from trusted suppliers | Ensures accuracy and availability |
| Component Preparation | Verification and sorting of components | Reduces assembly errors |
2. Assembly Techniques
Using advanced assembly methods, we apply both Surface Mount Technology (SMT) and Through-Hole Technology (THT) to place and solder components onto the PCB. Our precision equipment and techniques ensure optimal placement and soldering for reliable connections.
| Technique | Description | Applications |
|---|---|---|
| SMT | Components are mounted directly onto the surface of the PCB | Ideal for high-density assemblies |
| THT | Components are inserted through holes in the PCB | Used for larger components and high-stress applications |
3. Inspection and Testing
To guarantee the highest quality, we conduct thorough inspection and testing at various stages of the assembly process. Automated Optical Inspection (AOI), X-ray inspection, and functional testing help identify and rectify any issues, ensuring your PCB performs as intended.
| Inspection Type | Description | Purpose |
|---|---|---|
| Automated Optical Inspection (AOI) | Uses cameras to inspect the board for defects | Detects soldering and placement errors |
| X-ray Inspection | Uses X-rays to inspect internal layers and connections | Identifies hidden soldering issues |
| Functional Testing | Tests the assembled board’s functionality | Ensures the board performs as intended |
4. Quality Control
Our commitment to quality is reflected in our stringent quality control measures. Each assembled PCB undergoes rigorous inspection to meet industry standards and client specifications, ensuring a product that is both reliable and durable.
| Quality Control Aspect | Description | Benefits |
|---|---|---|
| In-Process Inspections | Regular checks during assembly | Catches errors early |
| Final Inspection | Comprehensive review before shipment | Ensures compliance with specifications |
| Certification | Adherence to industry standards and certifications | Confirms quality and reliability |
5. Final Preparation and Shipping
Once assembly and testing are complete, we prepare your PCBs for delivery. This includes packaging and any final adjustments needed to ensure that your product arrives in excellent condition and ready for integration into your final application.
| Activity | Description | Benefits |
|---|---|---|
| Packaging | Secure and protective packaging of assembled boards | Prevents damage during transit |
| Final Adjustments | Last-minute tweaks and checks | Ensures boards are in optimal condition for delivery |
Choosing the Right PCB Assembly Technology
Selecting the appropriate assembly technology is crucial for the performance and reliability of your PCBs.
At Ardra Circuits, we evaluate your needs to recommend the best technology:
Surface Mount Technology (SMT)
SMT is commonly used for its efficiency and ability to create high-density, compact designs. It allows for quick and accurate component placement directly on the PCB surface.
Ball Grid Array (BGA)
BGA offers enhanced interconnection density and is suitable for high-performance applications. Its solder balls beneath the component provide excellent thermal and electrical conductivity.
Through-Hole Technology (THT)
THT is ideal for components that require strong mechanical bonds. This method involves inserting leads through the PCB and soldering them on the other side, providing durability for components under mechanical stress.
Mixed Technology Assembly
Mixed Technology Assembly integrates SMT, THT, and BGA, allowing us to leverage the strengths of each technique to meet various design requirements.
Unmatched Expertise, Quality, and Precision
Precision Manufacturing:
Our use of advanced technology ensures high accuracy and reliability in every assembly.
Expertise and Experience:
Our team’s extensive experience guarantees that your project benefits from skilled craftsmanship and industry knowledge.
Custom Solutions:
We offer tailored solutions to meet your specific requirements, ensuring your PCB assemblies are optimized for performance and efficiency.
Commitment to Quality:
Adhering to the highest industry standards, including IPC-A-610 certifications, we ensure your assemblies meet exacting quality benchmarks.
Timely Delivery:
We prioritize efficient production to deliver your assemblies on schedule, every time.
Capabilities Overview
| Capability | Description |
|---|---|
| Advanced SMT Lines | High-precision SMT assembly with multiple lines for both single and double-sided boards. |
| IPC Class 2 & 3 Assembly | High-quality assembly conforming to IPC-A-610 Class 2 and Class 3 standards. |
| Thick/Thin Film Microelectronics | Expertise in microelectronics for both thick and thin film applications. |
| Chip-on-Board (COB) Technology | Advanced COB technology for high-density and high-performance applications. |
| Flexible and Rigid-Flex PCB | Capabilities in manufacturing flexible and rigid-flex PCBs for complex designs. |
| Automated Cleaning Solutions | Efficient cleaning processes to ensure board integrity and reliability. |
| BGA Rework | Specialized BGA rework capabilities for repair and maintenance. |
| Complete End Product Assembly | Full assembly services including box build, system integration, and final testing. |
Get in Touch.
We’d love to hear from you.
- Ardra Circuits Pvt Ltd (ACPL)
- Address:403, level 4 Satyamev Eminence, Ahmedabad, Gujarat, India
- Phone: +49 15566227765
- Phone: +91 9724242267
- Email: abhay@ardracircuits.com
